International Electronics Packaging Design and Manufacturing Conference (EPDMC 2026)

INTRODUCTION The International Electronics Packaging Design and Manufacturing Conference (EPDMC 2026) was successfully organized at Manav Rachna International Institute of Research and Studies. The conference served as a global platform for industry experts, researchers, academicians, and students to discuss innovations and advancements in electronics packaging, semiconductor technology, and advanced manufacturing. The three-day conference featured keynote sessions, technical presentations, startup exhibitions, and panel discussions focusing on emerging trends in the electronics manufacturing ecosystem. The event aimed to strengthen collaboration between academia and industry while encouraging research and innovation among young professionals and students. KEY HIGHLIGHTS The conference included a wide range of engaging activities and knowledge sessions: • Keynote Addresses delivered by global industry leaders highlighting the future of semiconductor manufacturing and electronics packaging. • Technical Sessions & Research Presentations where researchers and academicians presented cutting-edge innovations in electronics design and manufacturing technologies. • Panel Discussions focused on industry challenges, emerging technologies, and opportunities within the global semiconductor ecosystem. • Startup Exhibition and Pitching Sessions where innovative startups showcased their technological solutions and interacted with investors, mentors, and industry experts. • Student Engagement Activities encouraging young innovators to explore research, entrepreneurship, and career opportunities in advanced technology domains. The conference created an excellent opportunity for networking, knowledge exchange, and collaboration between academia, startups, and industry. . CONCLUSION The EPDMC 2026 Conference proved to be a highly impactful and enriching event that successfully brought together thought leaders, innovators, and aspiring professionals under one platform. Through insightful discussions, technical sessions, and startup engagements, the conference strengthened the connection between research, industry, and innovation. The event not only enhanced participants' understanding of emerging technologies but also encouraged students and researchers to actively contribute to the growing electronics and semiconductor ecosystem.